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Connectivity / AiP Module

Connectivity Module

Near-field communication modules enable wireless internet and wireless connection between devices.
Mainly implemented in the 2.4GHz, 5GHz and 6GHz frequency bands, they are equipped with small and thin parts through small form factor packaging technology to provide high-density small form factor module solutions.

Applications
Smartphone, Tablet, Laptop, Home Appliances
General Features
IEEE 802.11 a/b/g/n/ac/ax Standard Compliant
Simulation & Analysis

Design optimized to achieve
high-performance
low-power capabilities

Discrete (CoB) Module 40%

Application of high-density
small form factor
packaging technology

Advance adoption of
new standard technology
to provide high-speed
wireless communication

Proven production
capacity with over 20 years
of R&D in WiFi and history of
mass production of
cutting-edge products

Strategic partnership
with IC companies

Stable SCM achieved
through internalizing
components supply

Line-up

11n Single / BT 11ac 2x2 MIMO RSDB RSDB + LAA 11ax

Broadcom

  • 11bgn (SDIO3.0)
  • BT4.1 with BT PA

Broadcom

  • 11ac, 2x2 MiMo (SDIO3.0)
  • BT4.0, Ext BPF

Broadcom

  • 11ac, 2x2 MiMo / PCIe
  • BT4.2, Ext BPF

Broadcom

  • 11ac, 2x2 MiMo / PCIe
  • BT5.0, Ext BPF,
    Shield-Type

Broadcom

  • 11ac, 2x2 MiMo / PCIe
  • BT5.0, Ext BPF&DPX,
    LAA Shield-Type

Broadcom

  • BT4.1 LE

Broadcom

  • 11ac, 2x2 MiMo / PCIe
  • BT4.1 BT AoA, Ext BPF

Broadcom

  • 11ac, 2x2 MiMo / PCIe
  • BT5.0, Ext BPF,
    Shield-Type

Broadcom

  • 11ac, 2x2 Mu-MiMo / PCIe
  • BT5.0, Ext BPF,
    Shield-Type

Broadcomdeveloping

  • 11ac, 2x2 Mu-MiMo
    (160MHz) / PCIe
  • BT5.0, Ext BPF&DPX
    LAA Shield-Type

Qualcomm

  • 11ac, 1x1 MiMo
  • BT4.0, Int BPF

Qualcommdeveloping

  • 11ac, 2x2 Mu-MiMo
  • BT5.1, Int BPF

Qualcommdeveloping

  • 11ac, 2x2 MiMo Mu-MiMo
  • BT5.1, Int BPF

Qualcommdeveloping

  • 11ac, 2x2 Mu-MiMo /
    PCIe
  • BT5.1, Int BPF, 2.4G /
    5G FE IC
  • Shield-Type

Qualcomm

  • 11ac, 2x2 MiMo / PCIe
  • 2.4G PA/LNA, 5G FEM
  • BT4.1, Ext BPF
    Shield-Type

WiGig Module

Unlike WiFi modules, WiGig modules use the 60GHz mmWave frequency band and offers a higher transfer rate than existing WiFi modules, providing adequate solutions for fields that require high-speed data transfer.
5G mmWave modules can be divided into RF Antenna modules that include RF IC and Baseband modules, and has a wide variety of products for each field of application.

Applications
Smartphone, Tablet, Laptop, Home Appliances, VR/AR, CPE/Router, FWA/Backhaul
General Features
IEEE 802.11 a/b/g/n/ac/ax Standard Compliant

High transfer rate provides
adequate solutions for
high-speed data transfer

Design optimized to achieve
high-performance capabilities
through antenna simulation and
analysis technology

Advance adoption of new
standard technology to
provide high-speed wireless
communication

Stable mass production
capabilities

Registration of reference
modules through strategic
partnerships with IC
companies

Line-up

11ad Pre-11ay
Mobile Fixed Mobile Fixed
Baseband Module

Qualcomm

  • 11ad BB PCIe Gen2
  • 1 RF Port
  • Q'com Reference

Qualcomm

  • 11ad BB PCIe Gen2
  • 3/8 RF Ports
  • Up to 4.6Gbps PHY. Rate
  • Q'com Reference

Qualcommdeveloping

  • Pre-11ay BB PCIe Gen3
  • Up to 10Gbps PHY. Rate
  • Q'com Reference

Qualcommdeveloping

  • Pre-11ay BB PCIe Gen3
  • 4 RF Ports
  • Up to 10Gbps PHY. Rate
  • Q'com Reference
RF Antenna Module

Qualcomm

  • 32 Chains
  • 20 ANTs Integrated
  • Q'com Reference

Qualcomm

  • 32 Chains
  • 32 ANTs Integrated
  • Q'com Reference

Qualcommdeveloping

  • Pre-11ay, 17 Chains
  • 15 ANTs Integrated
  • Slim Feature
  • Q'com Reference

Qualcommdeveloping

  • Pre-11ay, 32 Chains
  • 64 ANTs Integrated
  • Q'com Reference

Qualcomm

  • Pre-11ay, 32 Chains
  • 22 ANTs Integrated
  • Q'com Reference