SiP(System in Package) is a heterogeneous integration packaging technology that enables various functionalities through its outstanding thermal performance and a small form factor. Based on state-of-the-art technologies like SMT, Double Side Mold, Grinding, Laser Technology, Sputtering and Laser Cut, Hanwha NxMD manufactures SiP products that meet the clients’ needs.
Mobile
Energy
Mobility
Augmented
Reality
IoT
Computer
Networking