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SiP (System in Package)

SiP Solutions

SiP(System in Package) is a heterogeneous integration packaging technology that enables various functionalities through its outstanding thermal performance and a small form factor. Based on state-of-the-art technologies like SMT, Double Side Mold, Grinding, Laser Technology, Sputtering and Laser Cut, Hanwha NxMD manufactures SiP products that meet the clients’ needs.

Technologies

We create the ideal SiP solution with our state-of-the-art technology.

Applications

We provide solutions optimized for various industries and devices by combining
a wide variety of cutting-edge packaging technologies.

Mobile

Energy

Mobility

Augmented
Reality

IoT

Computer
Networking